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APPARATUS FOR SCATTERING FLOOR POWDER, METHOD FOR SCATTERING FLOOR POWDER, AND METHOD FOR PRODUCIN 发明申请

2023-09-01 4980 74K 0

专利信息

申请日期 2025-06-24 申请号 JP2006038464
公开(公告)号 JP2007217741A 公开(公告)日 2007-08-30
公开国别 JP 申请人省市代码 全国
申请人 TDK CORP
简介 PROBLEM TO BE SOLVED : To enable a floor powder to be uniformly scattered so as to prevent a molded body from being seized. SOLUTION : This scattering method includes scattering the floor powder 3 on a sintering tray 2 on which the molded body 1 is placed through holes 6b of a plate (for instance, a punched metal 6) having the approximately circular holes bored. In the punching metal 6, when a diameter of the hole 6b is represented by (D) and an average particle diameter of the floor powder 3 for sintering is represented by (d), the hole 6b satisfies the relation of 1.0≤D/d≤3.0. COPYRIGHT : (C)2007, JPO&INPIT


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