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SPATTERING DEVICE AND FILM FORMING METHOD 发明申请

2023-08-30 4490 1378K 0

专利信息

申请日期 2025-06-25 申请号 WOJP07050479
公开(公告)号 WO2007086276A1 公开(公告)日 2007-08-02
公开国别 WO 申请人省市代码 全国
申请人 ULVAC INC; TAKASAWA Satoru; UKISHIMA Sadayuki; TANI Noriaki; ISHIBASHI Satoru
简介 A spattering device (1) has first to fourth targets (21a) to (21d). The first and second targets (21a, 21b) are disposed so that their surfaces face each other. The third and fourth targets (21c, 21d) are also disposed so that their surfaces face each other. When a dielectric film is formed, the first and second targets (21a, 21b) and the third and fourth targets (21c, 21d) are alternately spattered. When two of the targets (21a to 21d) with their surfaces facing each other are spattered, the other two of the targets (21a to 21d) function as the earth. As the result, abnormal electric discharge can be suppressed.


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