| 简介 |
PROBLEM TO BE SOLVED : To provide a water dispersion type adhesive composition which can be coated in an aqueous system and from which water dispersion type acrylic adhesive sheets for re-exfoliation that can suitably be used as adhesive sheets for processing semiconductor wafers, little stain the surfaces of adherents, and have high water impregnation resistance on the grinding of the wafers, can especially be produced.
SOLUTION : This adhesive composition containing as a main component an acrylic emulsion-based polymer obtained by the emulsion polymerization of a monomer mixture consisting mainly of an alkyl (meth)acrylate, and further containing a carbodiimide cross-linking agent is characterized in that the monomer mixture is contained in an amount of 0.5 to 10 pts.wt. per 100 pts.wt. of all the monomers, and the glass transition temperature of the acrylic emulsion is -80 to -20°C.
COPYRIGHT : (C)2007, JPO&INPIT |
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