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WATER DISPERSION TYPE ACRYLIC ADHESIVE COMPOSITION FOR RE-EXFOLIATION AND ADHESIVE SHEET 发明申请

2023-10-02 3100 94K 0

专利信息

申请日期 2025-07-09 申请号 JP2005374553
公开(公告)号 JP2007177003A 公开(公告)日 2007-07-12
公开国别 JP 申请人省市代码 全国
申请人 NITTO DENKO CORP
简介 PROBLEM TO BE SOLVED : To provide a water dispersion type adhesive composition which can be coated in an aqueous system and from which water dispersion type acrylic adhesive sheets for re-exfoliation that can suitably be used as adhesive sheets for processing semiconductor wafers, little stain the surfaces of adherents, and have high water impregnation resistance on the grinding of the wafers, can especially be produced. SOLUTION : This adhesive composition containing as a main component an acrylic emulsion-based polymer obtained by the emulsion polymerization of a monomer mixture consisting mainly of an alkyl (meth)acrylate, and further containing a carbodiimide cross-linking agent is characterized in that the monomer mixture is contained in an amount of 0.5 to 10 pts.wt. per 100 pts.wt. of all the monomers, and the glass transition temperature of the acrylic emulsion is -80 to -20°C. COPYRIGHT : (C)2007, JPO&INPIT


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