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A method for manufacturing the PDP or PALC protective film and PDP or PALC and using the same 发明授权

2023-11-05 2650 498K 0

专利信息

申请日期 2025-07-07 申请号 JP11182814
公开(公告)号 JP3941289B2 公开(公告)日 2007-07-04
公开国别 JP 申请人省市代码 全国
申请人 Mitsubishi Materials Corp6264
简介 PROBLEM TO BE SOLVED : To prevent lowering of adhesiveness and matching performance of a protective film to a substrate (dielectric layer), and to prevent lowering of electrical insulating property of the protective film, and to prevent a changes of MgO to MgCO3 or Mg (OH)2 or the like which are harmful to FPD, while preventing a film body or MgO included in the film body from reacting with CO2 gas and H2O gas included in the atmospheric air by a fluoride layer. SOLUTION : The surface of a substrate 13 is formed with a film body 14a, and a surface of the film body 14a is formed with a fluoride layer 14b. As a fluoride layer, MOXFY (M represents Mg, Ca, Sr, Ba, and a compound metal of alkali earth metal and rare earth metal satisfying relations 0<=X<2, 0


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