| 简介 |
PURPOSE : A Cu-Ni-Sn-P alloy which achieves high stress relaxation property having a stress relaxation ratio of 15%% or less in the direction perpendicular to the rolling direction is provided.
CONSTITUTION : As a copper alloy comprising, by mass percent, 0.1 to 3.0%% of Ni, 0.1 to 3.0%% of Sn, and 0.01 to 0.3%% of P with the balance being copper and inevitable impurities, a copper alloy having excellent stress relaxation property is characterized in that a first peak position is within a range of 2.16 to 2.35 Å in a radial distribution function around a Ni atom according to an XAFS analysis method, wherein the first peak position indicates a distance between a Ni atom in Cu and an atom nearest to the Ni atom. The copper alloy further comprises, by mass percent, 0.5%% or less of Fe, 1%% or less of Zn, 0.1%% or less of Mn, 0.1%% or less of Si, and 0.3%% or less of Mg. The copper alloy further comprises, by mass percent, at least one element selected from the group consisting of Ca, Zr, Ag, Cr, Cd, Be, Ti, Co, Au and Pt with a total content of the element being 1.0%% or less. The copper alloy further comprises, by mass percent, at least one element selected from the group consisting of Hf, Th, Li, Na, K, Sr, Pd, W, S, C, Nb, Al, V, Y, Mo, Pb, In, Ga, Ge, As, Sb, Bi, Te, B and misch metals with a total content of the element being 0.1%% or less.
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