| 简介 |
PROBLEM TO BE SOLVED : To provide a plasma processing method capable of excellently carrying a substrate in/out of a plasma processing chamber while maintaining plasma in the plasma processing chamber, and evacuating/re-carrying in an etched member in a cleaning mode.
SOLUTION : When performing the predetermined plasma processing by using a plasma processing system comprising a plasma processing chamber A for performing the predetermined plasma processing to a substrate, a conveying chamber B for carrying the substrate in/out of the plasma processing chamber A, and a first gate valve G1 arranged between the plasma processing chamber A and the conveying chamber B to partition them, the plasma processing chamber A is set to be under the pressure atmosphere capable of generating plasma and plasma generated in the plasma processing chamber A is maintained. When the substrate is carried in from the conveying chamber B to the plasma processing chamber A, or the substrate is carried out from the plasma processing chamber A to the conveying chamber B, the pressure in the conveying chamber B is controlled to be equal to that in the plasma processing chamber A, and the first gate valve G1 is opened to carry in/out the substrate.
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