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CERIUM POLISHING MATERIAL 发明申请

2023-12-06 3860 1448K 0

专利信息

申请日期 2025-08-07 申请号 WOJP06320388
公开(公告)号 WO2007043614A1 公开(公告)日 2007-04-19
公开国别 WO 申请人省市代码 全国
申请人 MITSUI MINING SMELTING CO LTD; YAMAGUCHI Yasuhide; KUWABARA Shigeru
简介 [PROBLEMS] To provide a cerium polishing material that as long as CeO2/TREO≥40 mass%, irrespective of whether or not F, La or Nd is contained, realizes high polishing speed and reduction of polishing flaw. [MEANS FOR SOLVING PROBLEMS] There is provided a cerium polishing material satisfying the relationship CeO2/TREO≥40 mass%, wherein when among peaks obtained by X-ray diffractometry using Cu-Kα ray or Cu-Kα1 ray with respect to a rare earth oxide composed mainly of rare earth element Ce, the peak ascribed to plane (111) is referred to as a, the intensity thereof as A, the peak ascribed to plane (220) as b, and the intensity thereof as B, the value of intensity ratio B/A is in the range of 0.20 to 0.80, and wherein the cerium polishing material has a specific surface area according to the BET method of 1 to 150 m2/g.


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