| 简介 |
PROBLEM TO BE SOLVED : To provide an epoxy resin composition excellent in reliability in that the cured composition with which a semiconductor device is encapsulated restrains corrosion of copper wiring, migration of copper, and formation of intermetallic compounds at the joint between aluminum and gold, and to provide a semiconductor device encapsulated with a cured product of the composition. SOLUTION : The invention relates to the epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) an inorganic filler, (D) a cure accelerator, (E) an adhesion promoter, and (F) a metal oxide, wherein the metal oxide (F) is a combination of (a) a magnesium-aluminum ion exchanger, (b) a hydrotalcite ion exchanger, and (c) a rare earth oxide in a ratio of (a) : (b) : (c)=0.5-20 : 0.5-20 : 0.01-10 pts by mass, relative to 100 pts by mass of the epoxy resin (A) and curing agent (B) combined, and the invention relates to the semiconductor device comprising a semiconductor element encapsulated with a cured product of the composition. COPYRIGHT : (C)2007, JPO&INPIT |
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