| 申请日期 | 2025-07-07 | 申请号 | WOUS06031776 |
| 公开（公告）号 | WO2007027428A2 | 公开（公告）日 | 2007-03-08 |
| 公开国别 | WO | 申请人省市代码 | 全国 |
| 申请人 | INDIUM CORPORATION OF AMERICA; HUANG Benlih; HWANG Hong sik; LEE Ning cheng | ||
| 简介 | A technique for increasing the compliance of tin-indium solders is disclosed. In one particular exemplary embodiment, the technique may be realized as a lead free solder alloy comprising from about 58.0% to about 99.998% by weight tin, from about 0.001% to about 40.0% by weight indium, and from about 0.001% to about 2.0% by weight at least one rare earth element. | ||
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