| 申请日期 | 2025-06-25 | 申请号 | US11206274 |
| 公开（公告）号 | US20070039826A1 | 公开（公告）日 | 2007-02-22 |
| 公开国别 | US | 申请人省市代码 | 全国 |
| 申请人 | CHANG CHIA HUA; SU CHERNG YUH; WU JEN CHIN; HSI JUN LUNG | ||
| 简介 | A thickening method of an electroforming shim is provided to increase the thickness of a metal shim. In this embodiment, an active solder with a rare earth element is used to increase the moisture on the substrate surface for the solder during the combining process. Afterwards the oxides of the rare earth element are expelled by mechanical stirring to produce a clean contact surface. The melted fillers moisturize on the substrate surface to achieve the combination. | ||
|
您还没有登录，请登录后查看下载地址
|
客服热线：
手机版
二维码
