| 简介 |
PURPOSE : Provided is an epoxy resin composition, which is useful for sealing a semiconductor device and forms a cured product capable of inhibiting corrosion and migration of copper wires and production of intermetallic compound at a junction between aluminum and gold.
CONSTITUTION : The epoxy resin composition comprises : (A) an epoxy resin; (B) a phenolic resin curing agent; (C) an inorganic filler; (D) a curing accelerator; (E) an adhesion enhancer; and (F) a metal oxide. The metal oxide (F) comprises a composition of (a) a magnesium/aluminum-based ion exchange material, (b) a hydrotalcite-based ion exchange material and (c) a rare earth element oxide, wherein the ratio of (a) : (b) : (c) is 0.5-20 parts by weight : 0.5-20 parts by weight : 0.01-10 parts by weight, based on 100 parts by weight of the combined weight of (A) and (B).
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