| 简介 |
An active solder alloy, an electronic device package including the active solder alloy bonding an electronic device to a substrate, and a method of forming high-strength joints by soldering using the solder alloy. The alloy contains up to about 10%% by weight of an element or a mixture of elements selected from the group consisting of titanium, zirconium, hafnium, vanadium, niobium, or tantalum; between about 0.1 and 5%% by weight of an element or a mixture of elements selected from the group of the lanthanides (rare earths); between about 0.01 and 1%% by weight of gallium up to about 10%% by weight of silver; up to about 2%% by weight of magnesium; and a remainder consisting of tin, bismuth, indium, cadmium, or a mixture of two or more of these elements. The alloy enables low-temperature (less than about 180°C) soldering within relatively narrow melting ranges (less than about 10°C).
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