| 简介 |
PROBLEM TO BE SOLVED : To provide a semiconductor-encapsulating epoxy resin composition which has good flow and a low coefficient of linear expansion, exhibits low moisture absorption while having a high glass transition temperature, and excels in crack resistance on lead-free soldering, heat-resistant reliability and moisture-resistant reliability, and a semiconductor device encapsulated with a cured product of the resin composition.
SOLUTION : The epoxy resin composition comprises (A) a naphthalene type epoxy resin represented by formula (1) [wherein m and n are each 0 or 1; R is hydrogen, a 1-4C alkyl group or a phenyl group; G is a glycidyl group-containing organic group; and 35-85 pts.mass of the formula (1) when m=0 and n=0 and 1-35 pts.mass of the formula (1) when m=1 and n=1 are included per 100 pts.mass of the formula (1)], (B) a phenolic resin curing agent having at least one substituted or nonsubstituted naphthalene ring in the molecule, (C) an inorganic filler, and (D) at least one compound selected from a rare earth oxide or hydrotalcite compound.
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