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The resistance and the resistance of the thin film material manufacturing method using the same 发明授权

2023-01-05 3150 119K 0

专利信息

申请日期 2025-07-12 申请号 JP2004006981
公开(公告)号 JP3852446B2 公开(公告)日 2006-11-29
公开国别 JP 申请人省市代码 全国
申请人 SUMITOMO METAL MINING CO
简介 PROBLEM TO BE SOLVED : To provide a resistance thin film in which the attainment of high temperature stability and the regulation of a resistance temperature coefficient to almost zero can be simultaneously realized though their simultaneous realization has hitherto been impossible even by Ni-Cr-Al-Si based alloys. SOLUTION : Using a target obtained from a resistance thin film material having a composition comprising, by mass, 1 to 15% Al and 0.01 to 0.5% rare earth elements, and the balance substantially Cr and Ni in which the Cr/Ni reaches 0.15 to 1.1 by mass, a resistance thin film composed of an Ni-Cr-Al-rare earth element alloy is formed on an insulating material substrate by a sputtering process, and thereafter, the substrate with the thin film deposited is subjected to heat treatment at 200 to 500°C for 1 to 10 hr in the air, thus the resistance thin film for a thin film resistor is obtained. COPYRIGHT : (C)2005, JPO&NCIPI


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