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COPPER ALLOY 发明申请

2023-07-21 2160 512K 0

专利信息

申请日期 2025-07-08 申请号 JP2006052675
公开(公告)号 JP2006265731A 公开(公告)日 2006-10-05
公开国别 JP 申请人省市代码 全国
申请人 FURUKAWA ELECTRIC CO LTD
简介 PROBLEM TO BE SOLVED : To provide a copper alloy which has superior bendability, and is suitable for a connector and a terminal material for electric or electronic equipment with high tensile strength, for instance, a connector, a switch, a terminal material and a relay which are mounted in automobiles. SOLUTION : The copper alloy is composed of Ni and/or Si, at least one or more substances selected from B, Al, As, Hf, Zr, Cr, Ti, C, Fe, P, In, Sb, Mn, Ta, V, S, O, N, misch metal (MM), Co and Be, and the balance of Cu and unavoidable impurities. This copper alloy has a precipitate X composed of Ni and Si and a precipitate Y composed of Ni and/or Si and at least one substance selected from B, Al, As, Hf, Zr, Cr, Ti, C, Fe, P, In, Sb, Mn, Ta, V, S, O, N, misch metal (MM), Co and Be, and the particle size of the precipitate Y is 0.01 to 2 μm. COPYRIGHT : (C)2007, JPO&INPIT


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