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Semiconductor device 发明申请

2023-06-17 4120 585K 0

专利信息

申请日期 2025-07-26 申请号 JP2017566942
公开(公告)号 JPWO2017138505A1 公开(公告)日 2018-12-06
公开国别 JP 申请人省市代码 全国
申请人 パナソニック株式会社
简介 A semiconductor device includes : a substrate; a drift layer which is disposed on the substrate and has a groove; an underlayer which is disposed above the drift layer; a first opening which penetrates the underlayer to reach the drift layer; an electron transit layer and an electron supply layer which are disposed to cover the first opening; a second opening which penetrates the electron supply layer and the electron transit layer to reach the underlayer; a gate electrode which is disposed above the electron supply layer at a position corresponding to a position of the first opening; a source electrode which is disposed to cover the second opening and in contact with the underlayer; and a drain electrode which is disposed on a backside surface of the substrate. A bottom surface of the groove is closer to the substrate than a bottom surface of the first opening.


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