| 简介 |
This copper strand for a bonding wire is a copper strand for forming a bonding wire having a wire diameter of 180 µm or less. The strand diameter of the copper strand is between 0.15 and 3.0 mm. The copper strand is formed from one or more additional elements selected from Mg, Ca, Sr, Ba, Ra, Zr, Ti, and rare earth elements such that the total content is within a range between 0.0001 and 0.01 mass%, and copper and inevitable impurities as the balance. The copper strand has a specific grain boundary ratio (Ls/L), which is the ratio of the length of a specific grain boundary Ls to the total length L of the crystal grain boundary, that is 50% or greater as determined by EBSD. |
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