客服热线:18202992950

PLOW IMPLEMENT TO WHICH SUBSOIL PLOW WITH MOLD BOARD IS ATTACHED 发明申请

2023-04-16 3330 506K 0

专利信息

申请日期 2025-09-16 申请号 JP2005034330
公开(公告)号 JP2006217863A 公开(公告)日 2006-08-24
公开国别 JP 申请人省市代码 全国
申请人 SUGANO FARM MACH MFG CO LTD
简介 PROBLEM TO BE SOLVED : To provide a bottom plow implement to which subsoil plow with a mold board is attached, in which a subsoil layer of a part deeper than plow sole is excavated, dumped and ditched by the subsoil plow with the mold board at the same time when plow operation is carried out and water permeability is improved and a plow layer can partially be enlarged thereby. SOLUTION : In the plow implement, beam extending in the lower direction is attached to the rear of plow body of the plow implement and a chisel in the position deeper than that of plow sole is attached to the lower end of the beam and a mold board is installed above the chisel and soil raised by the chisel is damped into a gravel groove by the mold board to prepare a subsoil furrow-making section. As a result, traction resistance is reduced and after-operation is facilitated without exposing subsoil on the ground surface and crop yield is not reduced by influence of subsoil. Further, a partially thick subsoil layer is made in order to re-bury the subsoil in the subsoil furrow-making section and a rooting area is widened to enable increase of crop yield. COPYRIGHT : (C)2006, JPO&NCIPI


您还没有登录,请登录后查看下载地址


反对 0举报 0 收藏 0 打赏 0评论 0
下载排行
网站首页  |  关于我们  |  联系方式  |  使用协议  |  版权隐私  |  网站地图  |  排名推广  |  广告服务  |  积分换礼  |  网站留言  |  RSS订阅  |  违规举报  |  京ICP备2021025988号-4