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METHOD FOR FORMING ELECTROLYTIC COPPER PLATING FILM ON SURFACE OF RARE EARTH METAL-BASED PERMANENT M 发明申请

2023-01-04 1960 839K 0

专利信息

申请日期 2025-07-11 申请号 US16020650
公开(公告)号 US20180350519A1 公开(公告)日 2018-12-06
公开国别 US 申请人省市代码 全国
申请人 Hitachi Metals Ltd
简介 An object of the present invention is to provide a novel method for forming an electrolytic copper plating film having excellent adhesion on the surface of a rare earth metal-based permanent magnet. The method of the present invention as a means for achieving the object is characterized in that after a magnet is immersed in a plating solution, a cathode current density of 0.05 A/dm2 to 4.0 A/dm2 for performing an electrolytic copper plating treatment is applied thereto over 10 seconds to 180 seconds to start the treatment.


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