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The chemical reaction caused by heating and diffusion and compd. compound semiconductor and a manufa 发明授权

2023-01-07 4310 338K 0

专利信息

申请日期 2026-04-24 申请号 JP2002092663
公开(公告)号 JP3802831B2 公开(公告)日 2006-07-26
公开国别 JP 申请人省市代码 全国
申请人 Samsung Electronics Co Ltd
简介 A method of manufacturing a compound semiconductor includes the steps of forming a layered structure of dielectric layers including oxygen or sulfur, and an inter layer formed between the dielectric layers, including rare earth transition metal that is highly reactive to oxygen and sulfur, and heating the layered structure. As a result of the chemical reaction and diffusion of elements, one can change a heated portion of the layered structure to a semiconductor or an insulator, depending on the temperature to which the portion is heated.


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