| 简介 |
The invention relates to a process for producing a diamond-containing composite material. Diamond grains having a mean particle size of from 5 to 300 μm are infiltrated under atmospheric pressure or with the aid of pressure with a eutectic or near-eutectic alloy which has a solidus temperature of <900° C. and comprises at least one element or an alloy from the group consisting of Cu, Ag, Au and at least one element from the group consisting of Si, Y, Sc, rare earth metals or densified by hot pressing. The components produced in this way have a high thermal conductivity and low thermal expansion and are particularly useful as heat sinks for semiconductor components. |
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