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METHOD FOR FORMING SILICON NITRIDE LAYER 发明申请

2023-01-30 3130 68K 0

专利信息

申请日期 2025-06-25 申请号 JP2004379750
公开(公告)号 JP2006186186A 公开(公告)日 2006-07-13
公开国别 JP 申请人省市代码 全国
申请人 SHARP KK; MORI YUZO
简介 PROBLEM TO BE SOLVED : To provide a method for forming a silicon nitride layer which can form the silicon nitride layer having high denseness at a high speed. SOLUTION : In the method for forming a silicon nitride layer, plasma is generated from a nitrogen-contained gas flowed into between an electrode 2 and the surface of a silicon wafer 6 at atmospheric pressure or at a pressure close to the atmospheric pressure. Plasma 13 having a temperature gradient is brought into contact with the surface of the silicon wafer 6 to form a silicon nitride layer thereon. The nitrogen-contained gas is preferably a mixture gas of nitrogen and rare gases or a mixture gas of ammonia, rare and hydrogen gasses. COPYRIGHT : (C)2006, JPO&NCIPI


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