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The copper base alloy 发明申请

2023-11-27 3620 889K 0

专利信息

申请日期 2025-06-26 申请号 JP2005505232
公开(公告)号 JPWO2004090181A1 公开(公告)日 2006-07-06
公开国别 JP 申请人省市代码 全国
申请人 KITZ CORP
简介 This invention has for an object thereof the provision of a leadless copper-based alloy which mends the deterioration of tensile strength at elevated temperatures and enables the mechanical properties thereof to approximate the CAC406 by forming in the alloy texture thereof an alloy or an intermetallic compound with Bi and Pb existing independently or in a mutually joined state. For the purpose of accomplishing the object, this invention incorporates in the copper-based alloy an additive element capable of forming an alloy or an intermetallic compound with Bi and Pb existing independently or in a mutually joined state. The additive element is one or more members selected from the group consisting of Te, P, Zr, Ti, Co, In, Ca, B and misch metal.


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