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BOND MAGNET 发明申请

2023-10-27 3800 52K 0

专利信息

申请日期 2025-06-27 申请号 JP2004334970
公开(公告)号 JP2006147799A 公开(公告)日 2006-06-08
公开国别 JP 申请人省市代码 全国
申请人 DAIDO ELECTRONICS CO LTD
简介 PROBLEM TO BE SOLVED : To reconcile a high magnetic property and high mechanical strength in a bond magnet.SOLUTION : In the bond magnet, rare earth system alloy magnetic powder is used in place of conventional scale shape pieces. The powder of an average spherical particle diameter ranging from 20 to 200 μm is employed and blended at a high rate of 80 wt% to the whole weight so as to obtain high magnetic characteristics. At the same time, coupling processing is carried out to the spherical magnetic powder so as to improve the mechanical strength of the bond magnet to be obtained.COPYRIGHT : (C)2006, JPO&NCIPI


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