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Low thermal conductivity thermal barrier coating system and method therefor 发明申请

2023-03-02 1210 717K 0

专利信息

申请日期 2025-07-07 申请号 US11006367
公开(公告)号 US20060121294A1 公开(公告)日 2006-06-08
公开国别 US 申请人省市代码 全国
申请人 Brett Allen Rohrer Boutwell; Ramgopal Darolia; Curtis Alan Johnson; Irene Spitsberg; Mark Daniel Gorman; Yan Gao
简介 In accordance with an embodiment of the invention, a thermal barrier coating for inclusion in a thermal barrier coating system is provided. The thermal barrier coating comprises a compound having a rhombohedral phase. In accordance with another embodiment of the invention, a thermal barrier coating is provided that comprises a compound having the formula of : A4B3O12, wherein A is at least one rare earth element; and B is selected from the group consisting of Zr, Hf and mixtures thereof.


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