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METHOD OF FORMING DOPED CHALCOGENIDE LAYER, METHOD OF FORMING CHALCOGENIDE MEMORY ELEMENT, AND MET 发明授权

2022-12-29 4310 349K 0

专利信息

申请日期 2025-07-06 申请号 KR1020047003083
公开(公告)号 KR100586716B1 公开(公告)日 2006-05-29
公开国别 KR 申请人省市代码 全国
申请人 MICRON TECHNOLOGY INC
简介 A method of forming a chalcogenide memory element having a first electrode, a second electrode, and a doped chalcogenide layer interposed between the first electrode and the second electrode, the method comprising : forming a chalcogenide layer (215) on the first electrode (210); sputtering metal (240) onto the chalcogenide layer using a first plasma containing at least one component gas selected from the group consisting of neon and helium, thereby forming the doped chalcogenide layer (230), wherein the first plasma emits a UV component sufficient to induce diffusion of the sputtered metal into the chalcogenide layer; and sputtering metal (245) onto the doped chalcogenide layer using a second plasma containing at least one component gas having an atomic weight higher than an atomic weight of neon, thereby forming the second electrode (250).


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