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LOW-ADHESION MATERIAL AND RESIN MOLD 发明申请

2023-10-24 4760 82K 0

专利信息

申请日期 2025-06-30 申请号 JP2004318910
公开(公告)号 JP2006131429A 公开(公告)日 2006-05-25
公开国别 JP 申请人省市代码 全国
申请人 TOWA CORP; JAPAN FINE CERAMICS CT
简介 PROBLEM TO BE SOLVED : To provide an appropriate low-adhesion material which has low adherability with regard to the adherability between an organic material and the surface of a substance; and a resin mold having excellent release property. SOLUTION : In the case of forming a hardened resin by hardening a fluidity resin filled in a cavity 5, the resin mold 10 has low adherability with regard to the adherability between the mold surface 6 comprising a surface brought into contact with the fluidity resin, and the hardened resin. In the resin mold 10, a low adhesion material 3, which comprises a substance containing at least one rare earth element, is formed in a layered state in a part including the mold surface 6. The low adhesion material 3 contains, as a main component, Y2O3 being one of rare earth compounds in a content of ≥40 vol%. COPYRIGHT : (C)2006, JPO&NCIPI


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