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THE ALUMINIUM ALLOY BOARD MATERIAL EXCELLENT IN THERMAL CONDUCTIVITY AND FORMABILITY, AND ITS MANUF 发明申请

2023-03-05 1350 224K 0

专利信息

申请日期 2025-07-17 申请号 KR1020050013431
公开(公告)号 KR1020060042962A 公开(公告)日 2006-05-15
公开国别 KR 申请人省市代码 全国
申请人 MITSUBISHI ALUMINUM CO LTD
简介 PURPOSE : An aluminum alloy sheet capable of obtaining excellent thermal conductivity and conductivity and strength for high formability by optimizing compositions and optimizing manufacturing conditions in addition to the composition optimization of and a method for manufacturing the aluminum alloy sheet are provided. CONSTITUTION : An aluminum alloy sheet having excellent thermal conductivity and formability comprises, by mass percentage, 0.2 to 1.5% of Si, 0.2 to 1.5% of Mg, 0.015 to 0.2%, one or two selected from 0.02 to 0.15% of Mn and 0.02 to 0.14% and the balance of Al and inevitable impurities, and has a conductivity of 50% IACS or more and a thermal conductivity of 200 w/m·K or more. The aluminum alloy sheet further comprises, by mass percentage, 0.01 to 1% of Cu, 0.01 to 0.2% of a rare earth element and 0.0020 to 0.02% of Be. © KIPO 2006


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