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COATING SOLUTIONS FOR USE IN FORMING BISMUTH-BASED PARAELECTRIC OR FERROELECTRIC THIN FILMS, AND BI 发明申请

2023-04-15 4580 481K 0

专利信息

申请日期 2025-09-17 申请号 KR1020050019607
公开(公告)号 KR1020060043587A 公开(公告)日 2006-05-15
公开国别 KR 申请人省市代码 全国
申请人 TOKYO OHKA KOGYO CO LTD
简介 PURPOSE : Provided are a coating solution for a ferroelectric or paraelectric Bi-based dielectric thin film which is inhibited in the variation of metal composition, a paraelectric Bi-based dielectric thin film prepared by using the composition which has a high dielectric constant and a low leak current, and its preparation method.CONSTITUTION : The coating solution for a ferroelectric dielectric thin film comprises a metal oxide composite formed by the alkoxide of at least two metals of Bi and Ti represented by {Bi_(4-x), (La_z, B_(1-z))_x}_n (Ti_(3-y), A_y)O_(12+α), wherein A is at least one metal selected from V, Cr, Mn, Si, Ge, Zr, Nb, Ru, Sn, Ta and W; B is at least one metal selected from a rare earth element except lanthanum, Ca, Sr and Ba; 0<=x<4; 0<=y<=0.3; 0


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