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Low-adhesion material and mold for molding resin using the same 发明申请

2023-06-01 1510 700K 0

专利信息

申请日期 2025-06-24 申请号 US11262897
公开(公告)号 US20060093693A1 公开(公告)日 2006-05-04
公开国别 US 申请人省市代码 全国
申请人 Takaki Kuno; Yoshinori Noguchi; Keiji Maeda; Seiichi Suda; Satoshi Kitaoka; Naoki Kawashima; Masato Yoshiya
简介 A low-adhesion material containing a rare-earth element is formed as a layer or a film on a mold surface of a mold for molding a resin. A main component of the low-adhesion material is a rare-earth compound, and Y2O3 is used as an example. A content of the rare-earth compound in the low-adhesion material is not less than 40 percent by volume. Thereby, a mold for molding a resin having excellent releasability can be obtained.


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