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SPUTTERING TARGET FOR FORMING ELECTRODE FILM FOR SEMICONDUCTOR DEVICES AND METHOD OF ITS FABRICATION 发明申请

2023-01-28 1970 684K 0

专利信息

申请日期 2025-06-26 申请号 WOUS05035940
公开(公告)号 WO2006041989A2 公开(公告)日 2006-04-20
公开国别 WO 申请人省市代码 全国
申请人 TOSOH SMD INC; TOSOH CORPORATION; INASE Toshio; YATSUMANI Shunsuke; IVANOV Eugene Y; JORDAN Ronald G
简介 Disclosed is a sputtering target that may be used to provide an electrode for FPD devices. The target and resulting electrode inhibit the generation of hillocks and have reduced resistivity. These properties render the electrode suitable for use as a thin film transistor in an active matrix liquid crystal display and the like. The electrode for semiconductor devices is made of an aluminum-based alloy containing one or more alloying elements selected from rare earth alloying elements present in a total amount from 0.01 to 3 at % . The method of fabricating a target that, when sputtered, will provide for an electrode includes the steps of continuous casting with electromagnetic stirring, in which the elements mentioned above are dissolved in an A1 matrix, and precipitating part or all of the elements dissolved in the A1 matrix as intermetallic compounds during solidification. The target is made of an aluminum-based alloy containing the above elements by thermo mechanical fabrication, rolling or extrusion process.


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