申请日期 | 2025-06-27 | 申请号 | EP05022322 |
公开(公告)号 | EP1647352A1 | 公开(公告)日 | 2006-04-19 |
公开国别 | EP | 申请人省市代码 | 全国 |
申请人 | Stannol GmbH | ||
简介 | Solder with reduced de-alloying rate, for use with electronic components, has the following composition (wt%) : Ag and/or Cu and/or Sb 0.2 - 5; Co or at least two elements chosen from Fe, Co, Ni 0.001 - 1; an optional rare earth 0.001 - 0.5; optionally Pd or Pt 0.001 - 0.1; P 0.001 -0.01; the remainder being tin and impurities. An independent claim is included for a method for making the solder by adding the alloying components to tin or a tin alloy. |
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