| 简介 |
PROBLEM TO BE SOLVED : To provide an epoxy resin composition for sealing a semiconductor, which can give a cured product excellent in heat resistance and reliability of moisture resistance and to provide a semiconductor device sealed by the epoxy resin composition for sealing a semiconductor, which is excellent in heat resistance and reliability of moisture resistance and thus particularly useful in an industrial purpose.
SOLUTION : The epoxy resin composition for sealing a semiconductor comprises (A) an epoxy resin, (B) a curing agent for a phenol resin in such an amount that 0.5-1.5 molar ratio of a phenolic OH group contained in the curing agent for a phenol resin relative to 1 mole of an epoxy group contained in the epoxy resin, (C) 400-1, 200 mass amount of an inorganic filler relative to 100 mass amount of the total of (A) and (B), and (D) 0.5-20 mass amount of a rare earth metal oxide relative to 100 mass amount of the total of (A) and (B).
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