| 简介 |
A wire bump material of Au-Ag alloy comprising an Au alloy of ≥ 99.99 mass% purity composed of an Au matrix and trace addition elements and, contained therein, 1 to 40 mass% of Ag of ≥ 99.99 mass% purity, wherein as the trace addition elements, there are contained 5 to 50 mass-ppm of Ca, 1 to 20 mass-ppm of Be and/or 5 to 90 mass-ppm of rare earth element, and/or 10 to 90 mass-ppm of the total of at least one member selected from among Ge, Mg, Sr, Bi, Zn, Si, Ga, Sn, Sb, B and Li (with the proviso that in the use of B and Li alone, the amount is in the range of 0.5 to 40 mass-ppm), and wherein the rare earth element is Y, La, Ce, Eu, Nd, Gd and/or Sm. The ball configuration of the bump can be rendered truly spherical, the tail length reduced, the solder erosion resistance enhanced, etc., to thereby enhance the reliability of bump bonding to Al pad. |
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