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PLATING METHOD AND PLATING APPARATUS 发明申请

2023-11-06 4240 70K 0

专利信息

申请日期 2025-07-08 申请号 JP2004259581
公开(公告)号 JP2006077271A 公开(公告)日 2006-03-23
公开国别 JP 申请人省市代码 全国
申请人 TDK CORP
简介 PROBLEM TO BE SOLVED : To provide a plating method that prevents the reprecipitation of a component having eluted into a plating liquid from a rare-earth sintered magnet of an article to be plated, and inhibits the degradation of the adhesiveness and reliability of a plated film, and to provide a plating apparatus.SOLUTION : When plating a R-T-B base sintered magnet, this plating method includes supplying an oxidative gas to the plating liquid L to be used, to oxidize and precipitate the component, for instance Nd and Fe, in the R-T-B base sintered magnet, which has eluted into the plating liquid L during plating. In the above step, it is preferable to supply the oxidative gas in a bubble form into the plating liquid L, so as to enhance the contact efficiency of the gas with the eluted component in the plating liquid L. The plating apparatus preferably has a filter 16 so as to collect a precipitated oxide of the eluted component.COPYRIGHT : (C)2006, JPO&NCIPI


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