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Device substrate and method for producing device substrate 发明授权

2023-04-07 2850 892K 0

专利信息

申请日期 2025-08-14 申请号 US10401288
公开(公告)号 US7011706B2 公开(公告)日 2006-03-14
公开国别 US 申请人省市代码 全国
申请人 Takamitsu Higuchi; Setsuya Iwashita; Hiromu Miyazawa
简介 A device substrate is provided having : a Si(111) substrate; a buffer layer formed by epitaxial growth on the Si(111) substrate 11, and containing at least one of a rare earth metal oxide and an alkali earth metal oxide; and a semiconductor material layer formed by epitaxial growth on the buffer layer, and containing at least one of a group II–VI semiconductor material having a wurtzite structure and a group III–V semiconductor material having a wurtzite structure. The buffer layer preferably comprises a hexagonal crystal structure oriented in the (001) plane or a cubic crystal structure oriented in the (111) plane, and the semiconductor material layer preferably comprises a hexagonal crystal structure oriented in the (001) plane.


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