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MEASURING METHOD OF STRESS DISTRIBUTION INSIDE ADHESIVE LAYER 发明申请

2023-03-07 3550 75K 0

专利信息

申请日期 2025-07-26 申请号 JP2004217724
公开(公告)号 JP2006038586A 公开(公告)日 2006-02-09
公开国别 JP 申请人省市代码 全国
申请人 NAT INST OF ADV IND TECHNOL
简介 PROBLEM TO BE SOLVED : To provide a method for measuring a stress distribution inside an adhesive layer of a material. SOLUTION : Two bodies 2, 3 to be bonded are bonded by an adhesive 4 into which a stress light emission material is intermingled. When a mechanical stress is applied from the outside, the stress light emission material emits light. The emitted visible light is measured, to thereby acquire an external stress distribution inside the adhesive layer. The stress light emission material is formed by using a complex metal oxide including strontium (Sr) and aluminum (Al) as a base material and by doping a rare earth metal or a transition metal as a light emission center in the base material. COPYRIGHT : (C)2006, JPO&NCIPI


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