| 申请日期 | 2025-07-26 | 申请号 | US11193351 |
| 公开（公告）号 | US20060025501A1 | 公开（公告）日 | 2006-02-02 |
| 公开国别 | US | 申请人省市代码 | 全国 |
| 申请人 | Shoichi Osada; Eiji Nakayama | ||
| 简介 | Epoxy resin compositions comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) an inorganic filler, (D) a rare earth oxide, and optionally (E) a phosphazene compound cure into products having improved heat resistance and moisture-proof reliability and are best suited for the encapsulation of semiconductor devices. | ||
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