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High thermal conductivity AIN-SiC composite artificial dielectric material 发明申请

2023-06-19 2620 305K 0

专利信息

申请日期 2025-07-10 申请号 US10892720
公开(公告)号 US20060014623A1 公开(公告)日 2006-01-19
公开国别 US 申请人省市代码 全国
申请人 MIKIJELJ BILJANA
简介 Dense composites of dielectric material having high thermal conductivity and adjustable dielectric properties. The dense composites are composed of homogeneous mixtures of AlN and SiC with at least one member selected from the group consisting of Y2O3, La2O3, rare earth oxides, CaO and Li2O. These composites are ideally shaped into usable products such as traveling wave tubes and electronic accelerators for use in microwave environments.


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