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MANUFACTURING METHOD FOR PARTICLE BOARD, AND THE BOARD 发明申请

2023-01-22 4400 64K 0

专利信息

申请日期 2025-07-08 申请号 JP2004142204
公开(公告)号 JP2005324345A 公开(公告)日 2005-11-24
公开国别 JP 申请人省市代码 全国
申请人 SANDAI KK; KANBARA KAZUNARI; HOTTA CO LTD
简介 PROBLEM TO BE SOLVED : To suppress the diffusion of formaldehyde from the adhesive of a particle board to improve indoor environment. SOLUTION : Wood is cut to be ground and, after the ground wood is dried and sieved, an adhesive is added to the sieved ground wood. The adhesive added mixture is molded into a plate shape and compressed under heating to manufacture the particle board. As the adhesive, one kind of a resin selected from a urea resin, a urea-melamine cocondensate resin and a phenol resin and a powder of a rare element mineral based on zirconium is added to this resin. COPYRIGHT : (C)2006, JPO&NCIPI


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