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Globular shaped Bismuth inclusion in Lead-free copper based alloy materials 发明申请

2023-03-05 3370 334K 0

专利信息

申请日期 2025-07-19 申请号 KR1020040021507
公开(公告)号 KR1020050096346A 公开(公告)日 2005-10-06
公开国别 KR 申请人省市代码 全国
申请人 DAECHANG IND CO LTD
简介 PURPOSE : A lead-free brass alloy for globulization of bismuth inclusions is provided that is not harmful to the human body and shows excellent machinability by adding small quantities of bismuth(Bi), misch metal, phosphorous(P) and sulfur(S) except lead(Pb) to a brass alloy consisting of copper(Cu) and zinc(Zn). CONSTITUTION : A lead-free brass alloy for globulization of bismuth inclusions comprises 50 to 70 wt.% of copper(Cu), 0.5 to 3.5 wt.% of bismuth(Bi), 0.01 to 0.3 wt.% of misch metal, 0.01 to 0.3 wt.% of phosphorous(P) and the balance being zinc(Zn), wherein the lead-free brass alloy further comprises 0.1 wt.% or less of sulfur(S), and wherein the lead-free brass alloy further comprises 1.0 wt.% or less of the sum of iron(Fe) and tin(Sn). © KIPO 2006


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