| 简介 |
To provide a flexible printed wiring board excellent in a migration resistance. A method for manufacturing a flexible printed wiring board by way of circuit-etching a copper clad laminate, wherein the method comprising the steps of, after etching, (a) removal step of residual metallic component, namely pickling a circuit-etched substrate to remove metallic component from residual carboxyl metallic salt on a surface of a base material resin exposed in the gaps among circuits formed on the substrate, thereby converting into a carboxyl group; and (b) re-ring-closure step, namely heating the residual-metallic-component-removed substrate for 10 to 80 minutes under a high temperature atmosphere at 180 to 200 DEG C, thereby ring-closing the surface of a polyimide resin film exposed in the gaps among circuits formed on the substrate. |
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