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Method of manufacturing a compound semiconductor by heating a layered structure including rare earth 发明申请

2023-11-20 2590 810K 0

专利信息

申请日期 2026-04-24 申请号 US11109389
公开(公告)号 US20050196975A1 公开(公告)日 2005-09-08
公开国别 US 申请人省市代码 全国
申请人 KIM JOO HO; TOMINAGA JUNJI
简介 A method of manufacturing a compound semiconductor includes the steps of forming a layered structure of dielectric layers including oxygen or sulfur, and an inter layer formed between the dielectric layers, including rare earth transition metal that is highly reactive to oxygen and sulfur, and heating the layered structure. As a result of the chemical reaction and diffusion of elements, one can change a heated portion of the layered structure to a semiconductor or an insulator, depending on the temperature to which the portion is heated.


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