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WEED SUPPRESSING TAPE AND METHOD FOR SUPPRESSING WEED 发明申请

2023-04-05 2800 54K 0

专利信息

申请日期 2025-07-27 申请号 JP2004018116
公开(公告)号 JP2005210906A 公开(公告)日 2005-08-11
公开国别 JP 申请人省市代码 全国
申请人 TAKEI CO LTD
简介 PROBLEM TO BE SOLVED : To provide a weed suppressing material directly applicable even when a gap between joints or cracks is slender or the joints or cracks are filled with earth and sand and having excellent application efficiency, weather and abrasion resistances, and to provide a method for suppressing weeds. SOLUTION : A weed suppressing tape is prepared by providing an acrylic pressure-sensitive adhesive layer having 0.3-2.0 mm thickness on the undersurface of a surface layer part composed of a resin film having 0.05-0.7 mm thickness and forming a release sheet on the top surface of the surface layer part or providing a base layer part having 0.3-2.0 mm thickness and composed of an elastic material such as synthetic rubber on the undersurface of the surface layer part composed of the resin film having 0.05-0.7 mm thickness, further forming the adhesive layer on the undersurface of the base layer part and providing the release sheet on the top surface of the surface layer part. The resultant weed suppressing tape is applied onto the joints or cracks to remove the release sheet after the application. Weed suppressing effects last long with the excellent application efficiency and further with the weather and abrasion resistances.


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