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A circuit board having high strength and high reliability and manufacturing method thereof 发明授权

2023-06-09 3350 452K 0

专利信息

申请日期 2025-08-19 申请号 JP08069532
公开(公告)号 JP3678485B2 公开(公告)日 2005-08-03
公开国别 JP 申请人省市代码 全国
申请人 TOSHIBA CORPORATION3078
简介 PROBLEM TO BE SOLVED : To provide a highly reliable circuit board using high-strength Si3 N4 ceramics where the conductor layer is of low resistance, the position accuracy is high due to matching of shrinkage factor between the insulator layer and the conductor layer, the adhesion between the conductor layer and the insulator layer is firm, and a warp, breaking of a wire, etc., are hard to occur, and a semiconductor device using it. SOLUTION : In a circuit board 1 which includes at least an insulator layer and a conductor layer, at least one layer out of all the insulator layers 2 is a sintered substance which has β-Si3 N4 for its main ingredient, and contains one kind or more selected from the group of rare earth elements and alkaline earth elements, and besides at least one layer out of all the conductor layers 3 has at least one kind among Mo and W for its main ingredients, and contains one or more kinds of element selected from the group VIII elements in the periodic table.


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