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PLATING METHOD, METHOD FOR PRODUCING PLATED PRODUCT, AND PLATED PRODUCT 发明申请

2023-11-21 4890 117K 0

专利信息

申请日期 2026-04-22 申请号 JP2003431754
公开(公告)号 JP2005187891A 公开(公告)日 2005-07-14
公开国别 JP 申请人省市代码 全国
申请人 SEIKO EPSON CORP
简介 PROBLEM TO BE SOLVED : To provide a plating technique for preventing the generation of rust and blisters and further efficiently performing film deposition in a plated product of a rare earth bond magnet. SOLUTION : A plating method for depositing a nickel film on the surface of a rare earth bond magnet by electrochemical reaction is disclosed and includes : a step wherein a nickel film of a single layer is deposited using a plating bath containing nickel sulfate, nickel chloride and boric acid; and a surface activation step wherein, before the plating step, a rare earth bond magnet as the object to be plated is dipped into a hydrochloric acid with a concentration of 1 to 6% for 7 to 25 s, and is subjected to surface treatment.


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