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DIELECTRIC-COVERED ELECTRODE, AND THIN FILM DEPOSITION SYSTEM 发明申请

2023-05-11 1330 125K 0

专利信息

申请日期 2025-09-11 申请号 JP2003396963
公开(公告)号 JP2005154860A 公开(公告)日 2005-06-16
公开国别 JP 申请人省市代码 全国
申请人 KONICA MINOLTA HOLDINGS INC
简介 PROBLEM TO BE SOLVED : To provide a dielectric-covered electrode which has remarkably increased insulating properties, and can hold a discharge condition for a long period of time, and to provide a thin film deposition system provided with the dielectric-covered electrode. SOLUTION : The dielectric-covered electrode is obtained by thermally spraying particles consisting essentially of a first metal on the surface of an electrically conductive base material to apply a dielectric, and thereafter subjecting the surface layer of the dielectric to sealing treatment with a sealing agent consisting essentially of a second metal. The thin film deposition system 10 is provided with the dielectric-covered electrode. All the ion intensities of elements X belonging to boron, alkali metals and alkaline-earth metals detected from the surface of the dielectric after the sealing treatment to a prescribed depth according to dynamic SIMS (secondary ion mass spectrometry) measurement satisfy the ion intensities of the elements X/the ion intensity of the first metal ≤1.0×10-1, and also, at least one ion intensity in those of the elements X satisfies the inequality of 1.0×10-5≤the ion intensity of the element(s) X/the ion intensity of the first metal.


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