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FLOOR PANEL AND FLOOR STRUCTURE MAKING USE THEREOF 发明申请

2023-02-13 3580 281K 0

专利信息

申请日期 2026-04-24 申请号 JP2002293281
公开(公告)号 JP2005146505A 公开(公告)日 2005-06-09
公开国别 JP 申请人省市代码 全国
申请人 NIPPON TUNGSTEN
简介 PROBLEM TO BE SOLVED : To provide a floor panel excellent in sound insulation efficiency, workability and maintenability capable of facilitating the selection and interchange of finish flooring and, at the same time, corresponding also to a construction of a concrete slab of a substrate such as a mansion or the like and a floor structure making use thereof. SOLUTION : Floor joists 5 are arranged on substrate plywood 6, a panel heater 2 is mounted on the substrate plywood 6 between the floor joists 5, and the finish flooring 3 is placed on the upper surface of the panel heater to form the floor panel. The chief ingredient of the floor panel is a heat source of the panel heater (rare earth elements of Ba1-x-y-zSrxCayRz)TiO3(0≤x≤0.3, 0≤y≤0.2, 0


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