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ARTICLE INCLUDING SILICON SUBSTRATE, BOND LAYER AND ADDITIONAL LAYER FORMED ON BOND LAYER 发明申请

2023-12-11 4270 44K 0

专利信息

申请日期 2025-07-31 申请号 JP2004147103
公开(公告)号 JP2005096411A 公开(公告)日 2005-04-14
公开国别 JP 申请人省市代码 全国
申请人 UNITED TECHNOLOGIES CORPORATION
简介 PROBLEM TO BE SOLVED : To provide an improved bond layer for an environment-resistant film. SOLUTION : This article has the bond layer and an additional layer formed on the bond layer. The bond layer includes a silicon layer containing dispersed fibers, and at least some of the fibers are extensively present between the bond layer and the additional layer. The fiber is constituted of materials selected from the group consisting of (1) alumina, (2) yttria, (3) aluminum silicate, (4) silicon carbide, (5) silicon nitride, (6) compounds of a rare earth element, an alkaline earth element, aluminum, silicon, oxygen, yttrium, nitrogen, niobium, tantalum, hafnium. zirconium and carbon, and a mixture of (1) to (6).


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