客服热线:18202992950

Copper wiring with high temperature superconductor (HTS) layer 发明申请

2023-12-19 3040 460K 0

专利信息

申请日期 2025-06-26 申请号 US10684224
公开(公告)号 US20050077627A1 公开(公告)日 2005-04-14
公开国别 US 申请人省市代码 全国
申请人 YU CHEN HUA; TSENG HORNG HUEI; HU CHENMING; WANG CHAO HSIUNG
简介 Semiconductor devices and methods of forming the semiconductor devices using an HTS (High Temperature Superconductor) layer in combination with a typical diffusion layer between the dielectric material and the copper (or other metal) conductive wiring. The HTS layer includes a superconductor material comprised of barium copper oxide and a rare earth element. The rare earth element yttrium is particularly suitable. For semiconductor devices having other semiconductor circuits or elements above the wiring, a capping layer of HTS material is deposited over the wiring before a cover layer of dielectric is deposited.


您还没有登录,请登录后查看下载地址


反对 0举报 0 收藏 0 打赏 0评论 0
下载排行
网站首页  |  关于我们  |  联系方式  |  使用协议  |  版权隐私  |  网站地图  |  排名推广  |  广告服务  |  积分换礼  |  网站留言  |  RSS订阅  |  违规举报  |  京ICP备2021025988号-4